Dicing Saw

Once a complete circuit has been completed, it is ready to be cut into different parts. Normally the circuits are so small that many of the same circuit can be fabricated on the same wafer. The dicing saw is used to separate the individual circuits.

A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire to dice, cut, or groove semiconductor wafers, silicon, glass, ceramic, crystal, and many other types of material.

-http://en.wikipedia.org/wiki/Dicing_saw

Dicing Saw

Dicing Saw